Synthesis and Characterization of Metal Particles -Copper, Silver, Core-shell particles Electronic Packaging Materials and Process -Sinter bonding(pressure, pressureless)
이회운 Hoi Woon Lee
E-mail
lhu6675@gmail.com
Research Field
Electronic Packaging Materials and Process -Laser-assisted bonding
박병효 Byeoung Hyo Park
E-mail
Research Field
Synthesis and Characterization of Metal Particles -Copper dendrite, Core-shell particles Electronic Packaging Materials and Process -Sinter bonding(pressure, pressureless
